Wettability and shear strength of active Sn2Ti solder on Al₂O₃ ceramics

Abstract

Purpose

The purpose of this paper is to investigate the wettability of an active Sn2Ti solder on an Al₂O₃ ceramic material at temperatures of 700°C and higher. Based on the results of the wettability study, soldered joints of Al₂O₃ ceramics/Sn2Ti solder/steel type AISI 321 were fabricated and the variation of shear strength with time was determined.

Design/methodology/approach

For determining melting points, differential scanning calorimetry analysis was performed. The wetting angle of Sn2Ti solder on Al₂O₃ ceramics was measured using specially developed equipment with a 10‐3 Pa vacuum at temperatures of 700, 800, 850 and 900°C. The wetting angle on AISI 321 steel at a temperature of 850°C was also determined. The joints of Al₂O₃ ceramics/Sn2Ti solder/steel type AISI 321 were prepared at 900°C, in a vacuum for times 5, 10, 15 and 20 min.

Findings

The best wettability of Sn2Ti solder was achieved at a temperature of 900°C. The wetting angle at the parameter of 900°C/ for 15 min was 47.5°. The joints of Al₂O₃ ceramics/Sn2Ti solder/steel type AISI 321 attained a strength of 18.3 MPa. It was found that the microstructure of Sn2Ti solder consists of a tin matrix with the presence of a αTi6Sn5 phase.

Originality/value

The results of the work are of significance for the further development of soldering with active solders in a vacuum, as well as with the application of power ultrasound. The possibility of soldering Al₂O₃ ceramics with SnTi‐based solders was thus demonstrated.

Citation

Koleňák, R., Chachula, M., Šebo, P. and Koleňáková, M. (2011), "Wettability and shear strength of active Sn2Ti solder on Al₂O₃ ceramics", Soldering & Surface Mount Technology, Vol. 23 No. 4, pp. 224-228. https://doi.org/10.1108/09540911111169066