To read this content please select one of the options below:

The evolution of paste pressure during stencil printing

David J. Clements (Heriot‐Watt University, Edinburgh, UK)
Marc P.Y. Desmulliez (Heriot‐Watt University, Edinburgh, UK)
Eitan Abraham (Heriot‐Watt University, Edinburgh, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 3 July 2007

483

Abstract

Purpose

The objective of this investigation is the derivation of a mathematical model that describes the pressure characteristics of paste during the stencil printing process. This model is intended to generalise a qualitative understanding of these effects using squeegees that can be curved but otherwise are standard in design.

Design/methodology/approach

This is an analytical treatment of the paste behaviour from the foundations of continuity of fluid flow and shear stresses that are imparted by the squeegee blade movement.

Findings

An equation is obtained that profiles the pressure generated by the squeegee movement which, for the case of a linear squeegee, shows very good agreement with predicted pressure profiles using experimental data.

Practical implications

This model provides a theoretical framework for a better understanding of how to overcome the failure modes inherent in stencil printing, such as over‐ or under‐filled stencil cavities.

Originality/value

This is a generalisation of a previously developed mesh printing model. It goes beyond flat squeegee designs to describe the printing process when the blade and stencil are in contact. In addition, it encompasses non‐Newtonian fluid behaviour.

Keywords

Citation

Clements, D.J., Desmulliez, M.P.Y. and Abraham, E. (2007), "The evolution of paste pressure during stencil printing", Soldering & Surface Mount Technology, Vol. 19 No. 3, pp. 9-14. https://doi.org/10.1108/09540910710843720

Publisher

:

Emerald Group Publishing Limited

Copyright © 2007, Emerald Group Publishing Limited

Related articles