Passive assembly of parallel optical devices onto polymer‐based optical printed circuit boards

Abstract

Purpose

The purpose of this paper is to present the latest results from research and development into future optical printed circuit board (OPCB) interconnects and low‐cost assembly methods.

Design/methodology/approach

A novel method of high‐precision passive alignment and assembly to OPCBs was invented and a full evaluation platform developed to demonstrate the viability of this technique.

Findings

The technique was successfully deployed to passively align and assemble a lens receptacle onto an embedded polymer waveguide array in an electro‐OPCB. The lens receptacle formed a critical part of a dual lens pluggable in‐plane connection interface between peripheral optical devices and an OPCB. A lateral in‐plane mechanical accuracy of ±2 μm has been measured using this technique.

Research limitations/implications

As this is a free space optical coupling process, surface scattering at the exposed waveguide end facet was significant.

Originality/value

This paper details a novel method of passively assembling arbitrary optical devices onto multi‐mode optical waveguides and outlines the procedure and equipment required. A lens coupling solution is also presented which reduces susceptibility of a connecting optical interface to contamination.

Citation

Pitwon, R.C.A., Hopkins, K., Milward, D., Muggeridge, M., Selviah, D.R. and Wang, K. (2010), "Passive assembly of parallel optical devices onto polymer‐based optical printed circuit boards", Circuit World, Vol. 36 No. 4, pp. 3-11. https://doi.org/10.1108/03056121011087177