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OrmeSTAR Ultra – the organic metal nanofinish

B. Wessling (Enthone Nano Science Center – Ormecon GmbH, A Business of Enthone Inc., Ammersbek, Germany)
M. Rischka (Enthone Nano Science Center – Ormecon GmbH, A Business of Enthone Inc., Ammersbek, Germany)
J. Posdorfer (Enthone Nano Science Center – Ormecon GmbH, A Business of Enthone Inc., Ammersbek, Germany)

Circuit World

ISSN: 0305-6120

Article publication date: 9 February 2010

245

Abstract

Purpose

The purpose of this paper is to introduce a new class of surface finishes as an alternative to current final surface finishes.

Design/methodology/approach

This new finish utilises nanotechnology and is based on a new formulation of the “organic metal” (OM).

Findings

The final surface finish is an approximately 50 nm thin permanent layer, consisting of a complex between the OM and silver (Ag). Panels finished with OrmeSTAR™ Ultra show excellent solderability in spite of a low‐layer thickness and therefore offer significant advantages over existing surface finishes.

Originality/value

This new finish has proven to be a competitive alternative to current final finishes with excellent properties for soldering applications. The new nanotechnology can also significantly improve the environmental and economical consequences of solderable surface finishing.

Keywords

Citation

Wessling, B., Rischka, M. and Posdorfer, J. (2010), "OrmeSTAR Ultra – the organic metal nanofinish", Circuit World, Vol. 36 No. 1, pp. 14-21. https://doi.org/10.1108/03056121011015059

Publisher

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Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

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