Assessment of blind via holes – an alternative approach

Abstract

Purpose

To present a simple way of assessing blind vias, making failure analysis easier to perform and generating less controversy.

Design/methodology/approach

The paper describes a procedure that may be used to examine blind via hole interconnections for routine testing or during failure analysis of a printed circuit board.

Findings

The technique described complements existing methods for assessing vias.

Originality/value

The paper details a new method of via assessment that can be an alternative to established techniques.

Citation

Willis, B. (2008), "Assessment of blind via holes – an alternative approach", Circuit World, Vol. 34 No. 2, pp. 34-38. https://doi.org/10.1108/03056120810874564