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Productionisation issues for commercialisation of microfluidic based devices

Dennis Patrick Webb (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Benedikt Knauf (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Chanqing Liu (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
David Hutt (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)
Paul Conway (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)

Sensor Review

ISSN: 0260-2288

Article publication date: 11 September 2009

673

Abstract

Purpose

Microfluidic or “lab‐on‐a‐chip” technology is seen as a key enabler in the rapidly expanding market for medical point‐of‐care and other kinds of portable diagnostic device. The purpose of this paper is to discuss two proposed packaging processes for large‐scale manufacture of microfluidic systems.

Design/methodology/approach

In the first packaging process, polymer overmoulding of a microfluidic chip is used to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count. The second process involves the use of low‐frequency induction heating (LFIH) for the sealing of polymer microfluidics. The method requires no chamber, and provides fast and selective heating to the interface to be joined.

Findings

Initial work with glass microfluidics demonstrates feasibility for overmoulding through two separate sealing principles. One uses the overmould as a physical support structure and providing sealing using a compliant ferrule. The other relies on adhesion between the material of the overmould and the microfluidic device to provide a seal. As regards LFIH work on selection and structuring of susceptor materials is reported, together with analysis of the dimensions of the heat‐affected zone. Acrylic plates are joined using a thin (<10 μm) nickel susceptor providing a fluid seal that withstands a pressure of 590 kPa.

Originality/value

Microfluidic chips have until now been produced in relatively small numbers. To scale‐up from laboratory systems to the production volumes required for mass markets, packaging methods need to be adapted to mass manufacture.

Keywords

Citation

Patrick Webb, D., Knauf, B., Liu, C., Hutt, D. and Conway, P. (2009), "Productionisation issues for commercialisation of microfluidic based devices", Sensor Review, Vol. 29 No. 4, pp. 349-354. https://doi.org/10.1108/02602280910986601

Publisher

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Emerald Group Publishing Limited

Copyright © 2009, Company

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