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Hygrothermal buckling analysis of thin rectangular FGM plate with variable thickness

Tasneem Firdous Islam (Department of Mathematics, Rashtrasant Tukadoji Maharaj Nagpur University, Nagpur, India)
G.D. Kedar (Department of Mathematics, Rashtrasant Tukadoji Maharaj Nagpur University, Nagpur, India)

Engineering Computations

ISSN: 0264-4401

Article publication date: 7 May 2024

Issue publication date: 13 May 2024

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Abstract

Purpose

This paper aims to contribute novel insights into the analysis of thin functionally graded material (FGM) plates with variable thickness, considering both temperature-dependent and independent material properties, focusing on critical linear buckling temperature rise and the effect of critical linear moisture for various moisture concentrations.

Design/methodology/approach

The study derives stability and equilibrium equations for thin rectangular FGM plates under hygrothermal loading, employing classical plate theory (CPT). Buckling behavior is examined using Galerkin’s method to obtain pre-buckling force resultants.

Findings

The findings highlight significant increases in critical buckling temperature with aspect ratio, distinct temperature sensitivity between materials and increasing moisture susceptibility with larger aspect ratios. These insights inform material selection and design optimization for FGM plates under hygrothermal loading, enhancing engineering applications.

Research limitations/implications

This research primarily focuses on hypothetical scenarios and mathematical model development and analysis.

Originality/value

This paper presents original contributions in the field by addressing the hygrothermal buckling analysis of thin FGM rectangular plates with variable thickness, utilizing CPT, thereby enriching the understanding of structural behavior in varying environmental conditions.

Keywords

Citation

Islam, T.F. and Kedar, G.D. (2024), "Hygrothermal buckling analysis of thin rectangular FGM plate with variable thickness", Engineering Computations, Vol. 41 No. 3, pp. 710-726. https://doi.org/10.1108/EC-09-2023-0601

Publisher

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Emerald Publishing Limited

Copyright © 2024, Emerald Publishing Limited

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