Microelectronic packaging reliability using the RSM technique

Abstract

Purpose

The purpose of this paper is to identify the critical parameters that influence ball grid array and chip size package fatigue life in a random vibration environment by using a design of experimental (DOE) approach using simulation results.

Design/methodology/approach

The use of DOE and analysis of variation to identify the critical parameters and a response surface to generate a functional form for global modeling would be determined. Once the global modeling’s functional form was known, it can be used as boundary condition, which would be input to a local model. Knowing the critical stress, one would estimate the fatigue life from a damage model. It is the curvature of the printed wiring board in the region of the component of interest that is driving the component’s solder joint damage. The approach in this present work involves global-local modeling approaches. In the global model approach, the vibration response of the printed circuit board (PCB) will be determined.

Findings

This global model will give the response of the PCB at specific component locations of interest. This response is then fed into a local stress analysis for accurate assessment of the critical stresses in the solder joints of interest. The stresses are then fed into a fatigue damage model to predict the life.

Originality/value

The analysis proposed in this paper uses a failure type approach to damage analysis and involves global and local model approaches.

Citation

Wu, M.-L. (2010), "Microelectronic packaging reliability using the RSM technique", Soldering & Surface Mount Technology, Vol. 22 No. 2, pp. 3-12. https://doi.org/10.1108/09540911011036235